Automated Soldering Systems
Adaptek Systems is the industry leader in cost effective automated soldering solutions. Our time tested expertise in metallurgical bonding, plus offering the widest variety of process options, makes Adaptek Systems the logical choice for solving your most challenging soldering applications.
Our experienced team of design engineers and technicians can test and recommend several bonding options and then custom design your automated soldering system to meet your specific requirements.
Automated soldering work cells can be PLC or PC controlled and configured as single process units, programmible point-to-point indexing dial or palletized handling systems. Our design team can even integrate automated individual component or final part testing, mechanical hardware assembly, material handling and part marking functions into your system configuration for the greatest flexibility in turnkey production solutions.
Successful Automated Bonding Applications:
- Small Part Handling and Assembly
- Wire to terminal bonding
- Ceramic substrate soldering
- Flex circuit attachment
- Magnetic wire soldering
- Metallic part subassemblies
- Connector bonding
- Circuit board selective soldering
- Component pre-tinning
Induction Soldering
Ideal for rapid and uniform heating especially where heating only the metallic components is ideal.
Laser Soldering
Highly precise and very localized heat, ideal for very small areas, lowest potential cycle time.
Hydrogen Generated Microflame
Simple and rapid pin point heating, ideal for insulation displacement.
IR Reflow
Controlled and very low thermal shock, ideal for larger areas or multiple points.
Molton Wave, Fountains or Baths
Lower costs, one to hundreds of joints per cycle.
Conductive Iron
Low cost, ideal for single point applications, simple controls.
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Integrated with the above, soldering alloys can be automatically presented by:
- Paste dispensing from simple to precision metering
- Time based or precision measured wire feeding, single or multiple strands
- Automated feeding, placement or assembly of solder pre-forms